Layout based thermal simulations of 3D integrated circuits

Author

Slusarczyk, Krzysztof ; Kaminski, Marek ; Napieralski, Andrzej

Author_Institution

Dept. of Microelectron. & Comput. Sci., Tech. Univ. Lodz, Poland

fYear

2004

fDate

28-28 Feb. 2004

Firstpage

79

Lastpage

83

Abstract

In this paper, a three-dimensional (3D) thermal simulations of basic integrated circuit (IC) components are presented. The layout of the real application specific integrated circuit (ASIC) generated in CAD CADENCE software were loaded into the CFD-ACE environment, where the 3D thermal simulation was done. The influence of many heating points was considered in simulations. Comparison among several cooling conditions was also made and presented in the paper.

Keywords

MOSFET; application specific integrated circuits; cooling; digital simulation; heat sinks; heat transfer; integrated circuit layout; integrated circuit modelling; technology CAD (electronics); thermal management (packaging); 3D integrated circuits; ASIC; CAD CADENCE software; application specific integrated circuit; cooling conditions; layout based thermal simulations; Analytical models; Circuit simulation; Computational modeling; Computer simulation; Cooling; Integrated circuit modeling; Mesh generation; Microelectronics; Thermal loading; Three-dimensional integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004. Proceedings of the International Conference

Conference_Location

Lviv-Slavsko, Ukraine

Print_ISBN

966-553-380-0

Type

conf

Filename

1365877