Title :
Layout based thermal simulations of 3D integrated circuits
Author :
Slusarczyk, Krzysztof ; Kaminski, Marek ; Napieralski, Andrzej
Author_Institution :
Dept. of Microelectron. & Comput. Sci., Tech. Univ. Lodz, Poland
Abstract :
In this paper, a three-dimensional (3D) thermal simulations of basic integrated circuit (IC) components are presented. The layout of the real application specific integrated circuit (ASIC) generated in CAD CADENCE software were loaded into the CFD-ACE environment, where the 3D thermal simulation was done. The influence of many heating points was considered in simulations. Comparison among several cooling conditions was also made and presented in the paper.
Keywords :
MOSFET; application specific integrated circuits; cooling; digital simulation; heat sinks; heat transfer; integrated circuit layout; integrated circuit modelling; technology CAD (electronics); thermal management (packaging); 3D integrated circuits; ASIC; CAD CADENCE software; application specific integrated circuit; cooling conditions; layout based thermal simulations; Analytical models; Circuit simulation; Computational modeling; Computer simulation; Cooling; Integrated circuit modeling; Mesh generation; Microelectronics; Thermal loading; Three-dimensional integrated circuits;
Conference_Titel :
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004. Proceedings of the International Conference
Conference_Location :
Lviv-Slavsko, Ukraine
Print_ISBN :
966-553-380-0
