Reliability assessment of a wirebond chip-on-board package subjected to accelerated thermal cycling loading

Author

Pang, H.L.J. ; Tan, T.L. ; Leonard, J.F. ; Chen, Y.S.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore

fYear

1997

fDate

8-10 Oct 1997

Firstpage

93

Lastpage

97

Abstract

Accelerated thermal cycling reliability tests were conducted on wire-bond chip-on-board (COB) packages at Delco Electronics. Thermomechanical modeling employing nonlinear finite element analysis was conducted to simulate the thermal cycling induced stresses and strains in the wire-bond interconnection. The FEA simulation study provides deeper insights to the likely failure modes at the wire ball-wedge to silicon die region

Keywords

finite element analysis; heat treatment; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; lead bonding; thermal stresses; FEA simulation; accelerated thermal cycling loading; accelerated thermal cycling reliability tests; failure modes; nonlinear finite element analysis; reliability; silicon die; thermal cycling induced stress simulation; thermomechanical modeling; wire ball-wedge; wire-bond COB packages; wire-bond interconnection; wirebond chip-on-board package; Analytical models; Capacitive sensors; Electronic equipment testing; Electronic packaging thermal management; Finite element methods; Life estimation; Thermal conductivity; Thermal stresses; Thermomechanical processes; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Print_ISBN

0-7803-4157-0

Type

conf

DOI

10.1109/EPTC.1997.723892

Filename

723892