Title :
A study on accelerated preconditioning test
Author :
Sun, Yesheng ; Wong, E.C. ; Ng, C.H.
Author_Institution :
Silicon Syst., Singapore
Abstract :
Preconditioning testing (PT) is widely used in the semiconductor industry for the testing of plastic SMDs. This test has 6 levels with 3 different temperature-humidity (TH) settings, and thus at least 3 TH ovens are needed to support conventional PT over 6 levels. This paper proposes an accelerated PT method to replace the conventional method, where PT at 6 levels can be conducted under one TH setting. This means that one oven is needed for PT over 6 levels. Also, the accelerated PT test time and cost at levels 2-6 are greatly reduced. In addition, it is not necessary for inspectors to change TH settings, so that possible human errors can be avoided
Keywords :
humidity; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; life testing; plastic packaging; sensitivity; surface mount technology; thermal stresses; accelerated PT method; accelerated PT test cost; accelerated PT test time; accelerated preconditioning test; human errors; plastic SMDs; preconditioning testing; semiconductor industry; temperature-humidity ovens; temperature-humidity settings; test levels; Acceleration; Acoustic testing; Circuit testing; Life estimation; Moisture; Ovens; Plastic packaging; Semiconductor device packaging; Semiconductor device testing; System testing;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723893
