• DocumentCode
    2066702
  • Title

    Designing a fluid pump for microfluidic cooling systems in electronic components

  • Author

    Tay, Francis Eng Hock ; Li, Holden

  • Author_Institution
    Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
  • fYear
    1997
  • fDate
    8-10 Oct 1997
  • Firstpage
    115
  • Lastpage
    118
  • Abstract
    A valveless planar fluid pump based on the diffuser-nozzle principle has been designed and prototyped. The pump is of the reciprocating displacement type and comprises two pump chambers connected in parallel and each actuated by a piezoelectric drive disk on a glass diaphragm. Diffuser/nozzle elements are utilised as a flow rectifier on both sides of each chamber. Prototypes of the pump has been fabricated using stereolithography to verify the pump principle. Subsequent pumps are fabricated using various micro-fabrication techniques on silicon material. A pump head of 105 mm of water has been achieved and design efforts are now focused on increasing the pressure head. The intent is to fabricate the chambers, channels and diffuser/nozzles using the latest techniques such as deep reactive ion etching (DRIE) and anodic bonding. The depth of the pump and the nozzle width are both 0.3 mm
  • Keywords
    cooling; diaphragms; lithography; microactuators; micromachining; micropumps; nozzles; packaging; piezoelectric actuators; sputter etching; 0.3 mm; Si; anodic bonding; chamber fabrication; channel fabrication; deep reactive ion etching; diffuser-nozzle principle; diffuser/nozzle elements; diffuser/nozzle fabrication; electronic components; flow rectifier; fluid pump design; glass diaphragm; micro-fabrication techniques; microfluidic cooling systems; nozzle width; parallel pump chambers; piezoelectric drive disk actuator; pressure head; pump depth; pump head; reciprocating displacement pump; silicon material; stereolithography; valveless planar fluid pump; Cooling; Drives; Etching; Glass; Microfluidics; Prototypes; Pumps; Rectifiers; Silicon; Stereolithography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
  • Print_ISBN
    0-7803-4157-0
  • Type

    conf

  • DOI
    10.1109/EPTC.1997.723896
  • Filename
    723896