DocumentCode
2066702
Title
Designing a fluid pump for microfluidic cooling systems in electronic components
Author
Tay, Francis Eng Hock ; Li, Holden
Author_Institution
Dept. of Mech. Eng., Nat. Univ. of Singapore, Singapore
fYear
1997
fDate
8-10 Oct 1997
Firstpage
115
Lastpage
118
Abstract
A valveless planar fluid pump based on the diffuser-nozzle principle has been designed and prototyped. The pump is of the reciprocating displacement type and comprises two pump chambers connected in parallel and each actuated by a piezoelectric drive disk on a glass diaphragm. Diffuser/nozzle elements are utilised as a flow rectifier on both sides of each chamber. Prototypes of the pump has been fabricated using stereolithography to verify the pump principle. Subsequent pumps are fabricated using various micro-fabrication techniques on silicon material. A pump head of 105 mm of water has been achieved and design efforts are now focused on increasing the pressure head. The intent is to fabricate the chambers, channels and diffuser/nozzles using the latest techniques such as deep reactive ion etching (DRIE) and anodic bonding. The depth of the pump and the nozzle width are both 0.3 mm
Keywords
cooling; diaphragms; lithography; microactuators; micromachining; micropumps; nozzles; packaging; piezoelectric actuators; sputter etching; 0.3 mm; Si; anodic bonding; chamber fabrication; channel fabrication; deep reactive ion etching; diffuser-nozzle principle; diffuser/nozzle elements; diffuser/nozzle fabrication; electronic components; flow rectifier; fluid pump design; glass diaphragm; micro-fabrication techniques; microfluidic cooling systems; nozzle width; parallel pump chambers; piezoelectric drive disk actuator; pressure head; pump depth; pump head; reciprocating displacement pump; silicon material; stereolithography; valveless planar fluid pump; Cooling; Drives; Etching; Glass; Microfluidics; Prototypes; Pumps; Rectifiers; Silicon; Stereolithography;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN
0-7803-4157-0
Type
conf
DOI
10.1109/EPTC.1997.723896
Filename
723896
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