• DocumentCode
    2066741
  • Title

    The optimum thermal design of microchannel heat sinks

  • Author

    Zhimin, Wen ; Fah, Choo Kok

  • Author_Institution
    DSO Nat. Labs., Singapore
  • fYear
    1997
  • fDate
    8-10 Oct 1997
  • Firstpage
    123
  • Lastpage
    129
  • Abstract
    A thermal resistance model was set up to analyse the flow and heat transfer in microchannel heat sinks. Laminar, turbulent, developed and developing flow and heat transfer were considered in the analysis. Optimum thermal design of the heat sink was then studied using this model and a self-developed software package, where the influences of the heat sink´s channel aspect ratio, fin width to channel width ratio, and the channel width on heat sink performance under three flow constraints-constant coolant volume flow rate, constant pressure drop and constant pumping power-were extensively investigated over wide flow and heat transfer regimes. This paper documents the modelling or analysis methodologies and the results of the investigation which include guidelines for the optimum thermal design of microchannel heat sinks
  • Keywords
    cooling; design engineering; flow simulation; heat sinks; integrated circuit design; integrated circuit modelling; integrated circuit packaging; laminar flow; optimisation; thermal analysis; thermal resistance; turbulence; analysis methodologies; channel width; constant coolant volume flow rate; constant pressure drop; constant pumping power; developed flow; developing flow; fin width-to-channel width ratio; flow analysis; flow constraints; flow regime; heat sink; heat sink channel aspect ratio; heat sink performance; heat transfer; heat transfer regime; laminar flow; microchannel heat sinks; modelling methodologies; optimum thermal design; self-developed software package; thermal resistance model; turbulent flow; Coolants; Electronics cooling; Heat pumps; Heat sinks; Heat transfer; Microchannel; Resistance heating; Surface resistance; Thermal resistance; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
  • Print_ISBN
    0-7803-4157-0
  • Type

    conf

  • DOI
    10.1109/EPTC.1997.723898
  • Filename
    723898