• DocumentCode
    2066773
  • Title

    Process characterization on chemical deflash; leading to the elimination of over-etched leads

  • Author

    Dela Cruz, Raquel Frago

  • Author_Institution
    Allegro Microsyst. Phils. Inc., Paranaque, Philippines
  • fYear
    1997
  • fDate
    8-10 Oct 1997
  • Firstpage
    136
  • Lastpage
    140
  • Abstract
    Out-of-control situations are usually associated with process deviation, parametric errors, operator actions, environmental factors and other variables that can affect the process or product outcome. In leadframe pretreatment processes, the deflashing acid bath is the process medium. There are several factors that can contribute to the variability of the strength of reaction of the deflashing acid which, if not properly controlled, would lead to over-etched leads. These factors were identified as acid concentration, soaking time, bath temperature and batch size. Given these factors, an experiment was conducted to delve primarily into its corollaries with etch rate as the response. The test of hypothesis is used to determine the interaction relationship of the different variables. From this study, process controls, monitors and contingency measures were developed for the elimination of over-etched leads
  • Keywords
    environmental degradation; etching; integrated circuit packaging; integrated circuit testing; integrated circuit yield; monitoring; process control; surface chemistry; acid concentration; batch size; bath temperature; chemical deflash; deflashing acid; deflashing acid bath; environmental factors; etch rate; etch reaction strength; leadframe pretreatment processes; operator actions; over-etched leads; parametric errors; process characterization; process contingency measures; process controls; process deviation; process monitoring; process variables; soaking time; Chemical analysis; Chemical processes; Environmental factors; Etching; Lead compounds; Pollution measurement; Strips; Surface contamination; Systems engineering and theory; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
  • Print_ISBN
    0-7803-4157-0
  • Type

    conf

  • DOI
    10.1109/EPTC.1997.723900
  • Filename
    723900