DocumentCode :
2066773
Title :
Process characterization on chemical deflash; leading to the elimination of over-etched leads
Author :
Dela Cruz, Raquel Frago
Author_Institution :
Allegro Microsyst. Phils. Inc., Paranaque, Philippines
fYear :
1997
fDate :
8-10 Oct 1997
Firstpage :
136
Lastpage :
140
Abstract :
Out-of-control situations are usually associated with process deviation, parametric errors, operator actions, environmental factors and other variables that can affect the process or product outcome. In leadframe pretreatment processes, the deflashing acid bath is the process medium. There are several factors that can contribute to the variability of the strength of reaction of the deflashing acid which, if not properly controlled, would lead to over-etched leads. These factors were identified as acid concentration, soaking time, bath temperature and batch size. Given these factors, an experiment was conducted to delve primarily into its corollaries with etch rate as the response. The test of hypothesis is used to determine the interaction relationship of the different variables. From this study, process controls, monitors and contingency measures were developed for the elimination of over-etched leads
Keywords :
environmental degradation; etching; integrated circuit packaging; integrated circuit testing; integrated circuit yield; monitoring; process control; surface chemistry; acid concentration; batch size; bath temperature; chemical deflash; deflashing acid; deflashing acid bath; environmental factors; etch rate; etch reaction strength; leadframe pretreatment processes; operator actions; over-etched leads; parametric errors; process characterization; process contingency measures; process controls; process deviation; process monitoring; process variables; soaking time; Chemical analysis; Chemical processes; Environmental factors; Etching; Lead compounds; Pollution measurement; Strips; Surface contamination; Systems engineering and theory; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
Type :
conf
DOI :
10.1109/EPTC.1997.723900
Filename :
723900
Link To Document :
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