Title :
Understanding heat transfer in the lead-on-chip die bonding process
Author_Institution :
ESEC SA, Switzerland
Abstract :
Temperature is, besides pressure and bonding time, the key parameter controlling the lead-on-chip (LOC) die bonding process. It determines how fast the thermoplastic adhesive melts and thus how small the minimum lamination time can be. On the other hand, overheating the LOC tape may cause bubbles or decomposition of the polymers. Therefore, the absolute temperature of the LOC tape is an important issue. The paper describes the measurement of the evolution of temperature in the bonding process using a temperature sensor located between the die surface and the LOC tape. The experimental data is compared with numerical calculations. The paper concludes with analysis of how heat transfer is influenced by the thermal properties of the heated bonding tools and the thermal contact conductance between package and tools
Keywords :
adhesion; bubbles; heat transfer; integrated circuit packaging; integrated circuit testing; laminates; melting; microassembling; numerical analysis; polymer films; pyrolysis; semiconductor process modelling; thermal analysis; LOC die bonding process; LOC tape; LOC tape overheating; absolute LOC tape temperature; bonding process; bonding time; bubbles; die surface; heat transfer; heated bonding tools; lamination time; lead-on-chip die bonding process; lead-on-chip die bonding process control; lead-on-chip die bonding process temperature; package-bonding tool thermal contact conductance; polymer decomposition; polymers; temperature evolution; temperature sensor; thermal properties; thermoplastic adhesive; thermoplastic adhesive melting time; Bonding; Heat transfer; Lab-on-a-chip; Lamination; Microassembly; Polymers; Pressure control; Temperature control; Temperature sensors; Thermal conductivity;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723901
