DocumentCode :
2066934
Title :
FEA applications in DOE and design optimization
Author :
Lam, T.F.
Author_Institution :
Adv. Micro Devices (Singapore) PTE Ltd.
fYear :
1997
fDate :
8-10 Oct 1997
Firstpage :
177
Lastpage :
182
Abstract :
FEA (finite element analysis) has been widely used to simulate package behaviour in the recent years and proved to be a powerful tool to obtain a better understanding of package performance. However, as FEA becomes increasingly popular, new requirements are raised. Among them are the feasibility of using FEA to do DOE and design optimizations. In these applications, the packages have similar geometry but the component parameters (dimensions and material properties) are changeable. APDL (Ansys Parametric Design Language) was used to write FEA programs which can automatically build the required model, solve it, retrieve the results and do other complicated operations and calculations. By using this kind of programs, FEA becomes a powerful tool for DOE (design of experiments) and design optimizations
Keywords :
circuit CAD; circuit analysis computing; design of experiments; finite element analysis; packaging; APDL; Ansys Parametric Design Language; DOE; FEA; FEA applications; FEA programs; automatic model construction; automatic model solution; design of experiments; design optimization; finite element analysis; material properties; package component parameters; package geometry; package performance; package simulation; Analytical models; Computational geometry; Computer languages; Design optimization; Employee welfare; Finite element methods; Packaging; Performance analysis; Temperature; US Department of Energy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
Type :
conf
DOI :
10.1109/EPTC.1997.723906
Filename :
723906
Link To Document :
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