DocumentCode :
2066939
Title :
Gate oxide enhancement for whole chip ESD design between different power domains
Author :
Hongwei Li ; Guang Chen ; Huijuan Cheng
Author_Institution :
IP Dev. Center, Semicond. Manuf. Int. Corp., Shanghai, China
fYear :
2013
fDate :
28-31 Oct. 2013
Firstpage :
1
Lastpage :
4
Abstract :
ESD enhancement for gate oxide failure across different power domains is proposed in this paper by analyzing a typical interface damage case. The ESD failure curve and OBIRCH investigations go deep into chip internal circuit, thus several ESD flow path and corresponding solutions presented. In addition, the novel ESD design idea and troubleshooting method run through the whole which draw inferences about other cases from one instance.
Keywords :
electrostatic discharge; failure analysis; integrated circuit design; ESD enhancement; ESD failure curve; ESD flow path; OBIRCH; chip internal circuit; gate oxide enhancement; gate oxide failure; interface damage case; optical beam induced resistance change; whole chip ESD design; Decision support systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location :
Shenzhen
ISSN :
2162-7541
Print_ISBN :
978-1-4673-6415-7
Type :
conf
DOI :
10.1109/ASICON.2013.6811959
Filename :
6811959
Link To Document :
بازگشت