Title :
RBS measurement of the thickness of nanometer oxide layers: Adhesion strength between copper leadframe and molding compound correlated with the oxide layer thickness
Author :
Schmidt, R. ; Hosler, W. ; Tilgner, R.
Author_Institution :
Siemens AG, Munich, Germany
Abstract :
The thickness of the oxide layer on a copper die pad strongly influences the adhesion to the molding compound in an electronic device, and is an important parameter for the device reliability. We directly measured the oxide layer thickness between leadframe and molding compound using Rutherford backscattering spectroscopy and correlated these values with the adhesion strength in pull tests. We also examined the oxidation during post mold curing
Keywords :
Rutherford backscattering; adhesion; circuit reliability; circuit testing; copper; encapsulation; heat treatment; interface structure; mechanical testing; oxidation; packaging; RBS measurement; Rutherford backscattering spectroscopy; adhesion; adhesion strength; copper die pad; copper leadframe; device reliability; electronic device; molding compound; oxidation; oxide layer thickness; post mold curing; pull tests; Adhesives; Backscatter; Copper; Energy loss; Lead compounds; Particle scattering; Projectiles; Spectroscopy; Thickness measurement; X-ray scattering;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723908
