Title :
Hands-on experience-based microelectronics manufacturing engineering education
Author :
Sang Jeen Hong ; Tae Min Ha
Author_Institution :
Dept. of Electron. Eng., Myongji Univ., Yongin, South Korea
Abstract :
We present a hands-on experience-based microelectronics manufacturing engineering education (MMEE) for a four-year university degree program in the area of microelectronics. Three hands-on experience-based courses are presented, along with a methodology for undergraduate students to acquire hands-on experience through integrated circuits (ICs) design, wafer fabrication and microelectronic packaging. Assessment for hands-on engineering education is considered. As a metric of assessment as learning, students´ survey was performed, and we confirmed that our hypothesis on the inclusion of hand-on experience-based courses for MMEE is beneficial to enhance students´ motivation of learning.
Keywords :
electronic engineering education; further education; integrated circuit design; semiconductor device manufacture; IC design; MMEE; four-year university degree program; hands-on experience-based microelectronics manufacturing engineering education; integrated circuits design; microelectronic packaging; undergraduate students; wafer fabrication; CMOS integrated circuits; Education; Fabrication; Microelectronics; Packaging; CMOS IC; Hands-on learning; Manufacturing; Microelectronics Packaging; Semiconductor Fabrication;
Conference_Titel :
Teaching, Assessment and Learning for Engineering (TALE), 2013 IEEE International Conference on
Conference_Location :
Bali
DOI :
10.1109/TALE.2013.6654446
