Die attach adhesion on leadframes treated with antioxidants

Author

Huneke, James T. ; Cowens, Marvin

Author_Institution

Quantum Mater. Inc., San Diego, CA, USA

fYear

1997

fDate

8-10 Oct 1997

Firstpage

208

Lastpage

214

Abstract

Antioxidant treatment of leadframes can reduce the initial die attach adhesion if the deposit creates an excess unbonded layer. The benzotriazole class of antioxidants can reduce the die attach adhesion over time by undergoing reactions that disrupt the leadframe/adhesive interface. The surface analysis techniques AES and ToF-SIMS were used to characterize the difference between good and bad leadframes. Other leadframe treatments were evaluated which have no effect on adhesion. These include the hindered phenol, hydrazine and thioester antioxidant compounds, as well as the inorganic A2 treatment. Cleaning methods for leadframes are proposed which are compatible with electronic packaging assembly lines

Keywords

Auger electron spectra; adhesion; adhesives; integrated circuit packaging; microassembling; oxidation; secondary ion mass spectra; surface chemistry; surface cleaning; surface contamination; time of flight mass spectra; AES; ToF-SIMS; adhesion; antioxidant treatment; antioxidants; benzotriazole antioxidants; cleaning methods; die attach adhesion; electronic packaging assembly lines; excess unbonded layer; hindered phenol antioxidant compounds; hydrazine antioxidant compounds; inorganic A2 treatment; leadframe treatments; leadframe/adhesive interface; leadframe/adhesive interface reactions; leadframes; surface analysis techniques; thioester antioxidant compounds; Adhesives; Assembly; Bonding; Coatings; Copper; Electronics packaging; Lead; Microassembly; Resins; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Print_ISBN

0-7803-4157-0

Type

conf

DOI

10.1109/EPTC.1997.723911

Filename

723911