Recent advances in surface and thin film analysis methods for application to packaging problems

Author

von Criegern, Rolf ; Budde, Klaus ; Hoesler, Wolfgang ; Holzapfel, Winfried

Author_Institution

Siemens AG, Munich, Germany

fYear

1997

fDate

8-10 Oct 1997

Firstpage

270

Lastpage

276

Abstract

After a short summary of the “classical” surface analysis methods such as XPS, AES, SIMS, and RBS, a few recent advances in the field of surface and thin film analysis are described that are of relevance for analysis of problems related to packaging technologies. These methods include: chemical state depth profiling with AES, multi-element depth profiling with TOF-SIMS, and three different analytical methods for the sensitive chemical analysis of organic surface contaminations: thermal desorption-gas chromatography/mass spectroscopy (TD-GC/MS), ion mobility spectrometry (IMS), and TOF-SIMS

Keywords

Auger electron spectra; Rutherford backscattering; X-ray photoelectron spectra; chromatography; electronic equipment testing; mass spectroscopic chemical analysis; packaging; secondary ion mass spectra; spectrochemical analysis; surface contamination; thermally stimulated desorption; time of flight mass spectra; AES; AES chemical state depth profiling; IMS; RBS; SIMS; TD-GC/MS; TOF-SIMS; TOF-SIMS multi-element depth profiling; XPS; ion mobility spectrometry; organic surface contaminations; packaging; packaging technology; sensitive chemical analysis; surface analysis methods; thermal desorption-gas chromatography/mass spectroscopy; thin film analysis methods; Atomic layer deposition; Chemical analysis; Chemical technology; Information analysis; Mass spectroscopy; Optical microscopy; Packaging; Scanning electron microscopy; Surface contamination; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Print_ISBN

0-7803-4157-0

Type

conf

DOI

10.1109/EPTC.1997.723921

Filename

723921