Title :
Experimental modal analysis of PBGA printed circuit board assemblies
Author :
Yang, Q.J. ; Lim, G.H. ; Lin, R.M. ; Yap, F.F. ; Pang, H.L.J. ; Wang, Z.P.
Author_Institution :
Nanyang Technol. Inst., Singapore
Abstract :
In order to understand the dynamic properties and develop a valid finite element model of a plastic ball grid array (PBGA) PCB assembly, a series of experimental modal tests have been conducted and reported in this paper. Firstly, the purpose and importance of conducting these experimental modal tests are discussed. Secondly, detailed test results of our PBGA PCB assembly are presented, which can serve as a valuable reference for those who are interested in the vibration fatigue reliability of PBGA PCB assemblies. Lastly, some factors which have an important influence on the modal test results of the PCB assembly are discussed
Keywords :
ball grid arrays; circuit reliability; dynamic testing; fatigue; finite element analysis; integrated circuit packaging; modal analysis; plastic packaging; printed circuit testing; vibrational modes; PBGA PCB assembly; PBGA printed circuit board assemblies; PCB assembly; dynamic properties; experimental modal analysis; finite element model; modal tests; plastic ball grid array PCB assembly; vibration fatigue reliability; Assembly; Boundary conditions; Electronic equipment testing; Electronics packaging; Fatigue; Finite element methods; Mechanical factors; Modal analysis; Printed circuits; Vehicle dynamics;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723924
