Title :
3.5 Gb/s×4 ch optical interconnection module for ATM switching system
Author :
Tanaka, Nobuyuki ; Arai, Yoshimitsu ; Takahara, Hideyuki ; Ando, Yasuhiro ; Ishihara, Noboru ; Hino, Shigeki
Author_Institution :
NTT Opto-Electron. Labs., Tokyo, Japan
Abstract :
The developed optical interconnection module contains an AlN ceramic package with low thermal resistance, an LSI chip integrating the 3.5-Gb/s, 4-ch transmitter or receiver, and an optical submodule, which is assembled using a new passive-alignment technique. The use of the LSI chip reduces size to 6.5 cc and power dissipation to 6.1 W. The time needed to assemble the optical submodule is decreased to 1/20 by using the passive-alignment technique
Keywords :
asynchronous transfer mode; modules; optical interconnections; photonic switching systems; 3.5 Gbit/s; 6.1 W; ATM switching system; AlN; AlN ceramic package; LSI chip; optical interconnection module; optical submodule; passive alignment; power dissipation; receiver; thermal resistance; transmitter; Assembly; Ceramics; Integrated optics; Large scale integration; Optical interconnections; Optical receivers; Optical transmitters; Packaging; Power dissipation; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606171
