DocumentCode
2067736
Title
Thermal Design of HBT Power Transistors for Mobile and Satellite Communications
Author
Mezui-Mintsa, R. ; Tsouli, M. ; Enkonda, Z. ; Hassaïne, N. ; Riet, M. ; Villeforceix, B. ; Konczykowska, A. ; Vuye, S. ; Wang, H.
Author_Institution
Centre National d´´Etudes des Télécommunications, Laboratoire de Bagneux, 196, avenue Henri Ravera, 92220 Bagneux (FRANCE)
Volume
2
fYear
1992
fDate
5-9 Sept. 1992
Firstpage
856
Lastpage
859
Abstract
HBT power transistors thermal analysis and its application to amplifier design are presented in this paper. Device analysis and optimization have been made with respect to the power handling capability. Power HBTs for mobile and satellite communications have been fabricated. A C-band MIC amplifier is also presented.
Keywords
Current density; Electronic ballasts; Fingers; Frequency; Heterojunction bipolar transistors; Power amplifiers; Power transistors; Satellite communication; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1992. 22nd European
Conference_Location
Helsinki, Finland
Type
conf
DOI
10.1109/EUMA.1992.335812
Filename
4135557
Link To Document