Reliability assessment of electronic components under random vibration loading

This paper targets the reliability of electronics components, specially avionics and automotive electronic system, under random vibration conditions. A fatigue life estimation procedure is presented and each step of procedure is explained. Finite Element model of the test vehicle is built in ANSYS. The model is first validated by correlating the natural frequencies, mode shapes and transmissibility functions from simulation with experimentally measured ones. The model is then used to simulate random vibration response spectrum at critical solder interconnects. The obtained results are then transformed into time domain and it´s number of cycles are counted to determine the effective number of cycles which can then be used to predict fatigue life with Miner´s damage rule.