• DocumentCode
    2068158
  • Title

    Thermally conductive circuit boards

  • Author

    Russ, Samuel H. ; Chen, Kung-Hsien

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of South Alabama, Mobile, AL, USA
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    465
  • Lastpage
    468
  • Abstract
    As device densities increase, heat is an increasing problem in electronic systems. However, circuit board materials are electrically insulating and therefore generally thermally insulating, causing ldquohot spotsrdquo around power-hungry components. This paper explores the advantages of selectively adding silicon carbide using pulsed laser deposition onto existing, conventional FR-4 circuit boards. It is shown that selectively adding thermally conductive but electrically insulating material reduces the temperature of surface-mount heat-dissipating elements on PWBs.
  • Keywords
    cooling; insulating materials; printed circuits; pulsed laser deposition; PWB; circuit board materials; electrically insulating material; surface-mount heat-dissipating elements; thermally conductive circuit boards; Conducting materials; Dielectrics and electrical insulation; Optical materials; Optical pulses; Printed circuits; Pulse circuits; Pulsed laser deposition; Silicon carbide; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074055
  • Filename
    5074055