DocumentCode
2068158
Title
Thermally conductive circuit boards
Author
Russ, Samuel H. ; Chen, Kung-Hsien
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of South Alabama, Mobile, AL, USA
fYear
2009
fDate
26-29 May 2009
Firstpage
465
Lastpage
468
Abstract
As device densities increase, heat is an increasing problem in electronic systems. However, circuit board materials are electrically insulating and therefore generally thermally insulating, causing ldquohot spotsrdquo around power-hungry components. This paper explores the advantages of selectively adding silicon carbide using pulsed laser deposition onto existing, conventional FR-4 circuit boards. It is shown that selectively adding thermally conductive but electrically insulating material reduces the temperature of surface-mount heat-dissipating elements on PWBs.
Keywords
cooling; insulating materials; printed circuits; pulsed laser deposition; PWB; circuit board materials; electrically insulating material; surface-mount heat-dissipating elements; thermally conductive circuit boards; Conducting materials; Dielectrics and electrical insulation; Optical materials; Optical pulses; Printed circuits; Pulse circuits; Pulsed laser deposition; Silicon carbide; Temperature; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074055
Filename
5074055
Link To Document