Title :
Thermally conductive circuit boards
Author :
Russ, Samuel H. ; Chen, Kung-Hsien
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of South Alabama, Mobile, AL, USA
Abstract :
As device densities increase, heat is an increasing problem in electronic systems. However, circuit board materials are electrically insulating and therefore generally thermally insulating, causing ldquohot spotsrdquo around power-hungry components. This paper explores the advantages of selectively adding silicon carbide using pulsed laser deposition onto existing, conventional FR-4 circuit boards. It is shown that selectively adding thermally conductive but electrically insulating material reduces the temperature of surface-mount heat-dissipating elements on PWBs.
Keywords :
cooling; insulating materials; printed circuits; pulsed laser deposition; PWB; circuit board materials; electrically insulating material; surface-mount heat-dissipating elements; thermally conductive circuit boards; Conducting materials; Dielectrics and electrical insulation; Optical materials; Optical pulses; Printed circuits; Pulse circuits; Pulsed laser deposition; Silicon carbide; Temperature; Thermal conductivity;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074055