DocumentCode :
2068411
Title :
Polarity dependent of gate oxide breakdown from measurements
Author :
Shili Wu ; Xiaowei He ; Yuwei Liu ; Guoan Chen
Author_Institution :
CSMC Technol. Corp., Wuxi, China
fYear :
2013
fDate :
28-31 Oct. 2013
Firstpage :
1
Lastpage :
2
Abstract :
In this work, polarity dependent of gate oxide breakdown is investigated for both NMOS and PMOS in a large range of oxide thicknesses, 27Å, 170Å and 850Å. All the devices are measured using constant voltage stress (CVS) method. From the measurements, It is found that for thick gate oxide, lifetime (TBD) under negative gate bias is always shorter regardless of the types of the MOSFETs. However, when the oxide thickness scaled down, the accumulation case gets shorter lifetime than the inversion case for both NMOS and PMOS. In addition, the gate current changes over the stress time for different oxide thicknesses are also exhibited which imply different breakdown processes.
Keywords :
MOSFET; semiconductor device breakdown; MOSFET; NMOS; PMOS; constant voltage stress method; gate current; negative gate bias lifetime; polarity dependent gate oxide breakdown; Anodes; Degradation; Electric breakdown; Logic gates; MOS devices; Stress; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location :
Shenzhen
ISSN :
2162-7541
Print_ISBN :
978-1-4673-6415-7
Type :
conf
DOI :
10.1109/ASICON.2013.6812018
Filename :
6812018
Link To Document :
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