Analytical modeling of crosstalk effects in coupled copper interconnects in deep sub micron technology

Author

Sahoo, Manodipan ; Rahaman, Hafizur

Author_Institution

Dept. of Inf. Technol., Bengal Eng. & Sci. Univ., Howrah, India

fYear

2012

fDate

17-19 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

Aggressive scaling has led to signal integrity and performance issues in today´s copper based interconnects. This paper presents an analytical model for delay and crosstalk in the copper based nanointerconnect systems. The proposed model is compared with SPICE and it is found that the proposed model is almost 100% accurate as SPICE and in an average ~70 times faster than SPICE. Using the proposed analytical model, the crosstalk delay and noise are estimated in copper based nanointerconnects for various submicrometer technology nodes (i.e. 45nm, 32nm, 22nm and 16nm) and interconnect lengths of 100μm, 500μm, 1mm, 5mm and 10mm respectively.

Keywords

SPICE; crosstalk; delay circuits; integrated circuit interconnections; integrated circuit noise; nanoelectronics; copper based nanointerconnect system; coupled copper interconnect; crosstalk delay; crosstalk effect; deep submicron technology; signal integrity; submicrometer technology nodes; crosstalk delay; crosstalk noise; submicron;

fLanguage

English

Publisher

ieee

Conference_Titel

Computers and Devices for Communication (CODEC), 2012 5th International Conference on

Conference_Location

Kolkata

Print_ISBN

978-1-4673-2619-3

Type

conf

DOI

10.1109/CODEC.2012.6509212

Filename

6509212