Analytical modeling of crosstalk effects in coupled copper interconnects in deep sub micron technology

Aggressive scaling has led to signal integrity and performance issues in today´s copper based interconnects. This paper presents an analytical model for delay and crosstalk in the copper based nanointerconnect systems. The proposed model is compared with SPICE and it is found that the proposed model is almost 100% accurate as SPICE and in an average ~70 times faster than SPICE. Using the proposed analytical model, the crosstalk delay and noise are estimated in copper based nanointerconnects for various submicrometer technology nodes (i.e. 45nm, 32nm, 22nm and 16nm) and interconnect lengths of 100μm, 500μm, 1mm, 5mm and 10mm respectively.