Design and modeling of planar transformer-based integrated passive devices for wireless applications

This paper presents design and modeling techniques of integrated passive devices (IPDs) that can be stacked with RF chips in a highly integrated and miniaturized 3D system-in-package (SiP) for wireless applications. The research starts to study winding and modeling techniques for high efficiency planar transformers. Based upon the proposed and modeled planar transformers, the research explores novel planar transformer-based structures for various kinds of wireless passive components including baluns, bandpass filters and power combiners to achieve miniature size as well as high performance. The IPDs presented in this study are manufactured in an Above-IC (AIC) process that is ready for mass production in semiconductor industry.