Title :
VLSI IC emission models for system simulation
Author :
Steinecke, Thomas ; Hesidenz, Dirk
Author_Institution :
Infineon Technol. AG, Neubiberg
Abstract :
The electromagnetic emission of complex very large scale integrated circuits is determined by their operation activity plus the manifold noise propagation paths through the on-chip power routing, the package traces and the planes and traces on the printed circuit board. Good simulation models have to serve two main interests: (1) identification of emission-related IC design weaknesses and estimation of real electromagnetic emission from (1) the IC manufacturerpsilas point of view and (2) the system manufacturerpsilas point of view. This paper presents the general setup for a full system emission simulation and explains the application of this model on a 32-bit automotive microcontroller containing 20 million transistors. Tool-related accuracy limitations of this VLSI emission modeling approach are discussed.
Keywords :
VLSI; circuit simulation; integrated circuit design; integrated circuit modelling; printed circuits; VLSI IC emission models; VLSI integrated circuit; automotive microcontroller; electromagnetic emission; electromagnetic emission estimation; emission-related IC design; full system emission simulation; large scale integrated circuits; manifold noise propagation paths; on-chip power routing; package traces; printed circuit board; system simulation; transistors; Circuit simulation; Electromagnetic interference; Electromagnetic propagation; Integrated circuit modeling; Integrated circuit noise; Integrated circuit packaging; Power system modeling; Routing; Very large scale integration; Virtual manufacturing;
Conference_Titel :
Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-981-08-0629-3
Electronic_ISBN :
978-981-08-0629-3
DOI :
10.1109/APEMC.2008.4559802