Title :
Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates
Author :
Francomacaro, A.S. ; Charles, H.K., Jr. ; Lehtonen, S.J. ; Keeney, A.C. ; Clatterbaugh, G.V. ; Banda, C.V.
Author_Institution :
Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD
Abstract :
Ultra-thin, flexible microcircuit assemblies using thinned die (down to 20 mum in thickness) and multilayer, thin film substrates (up to 4 conductor layers (five dielectric layers) at an overall thickness of approximately 10 mum) have been fabricated. Such circuits offer significant promise in many advanced packaging applications such as: biomedical implant and monitoring devices, wearing apparel electronics, conformal antennas and receiver/ transmitter systems, and appliques of all types.
Keywords :
flexible electronics; substrates; thin film circuits; advanced packaging applications; multilayer thin-film substrate; size 10 mum; size 20 mum; thinned die; ultra-thin flexible microcircuit assembly; Assembly; Biomedical monitoring; Conductive films; Dielectric substrates; Dielectric thin films; Electronics packaging; Implants; Nonhomogeneous media; Thin film circuits; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074071
