Title :
Solder bumping methods for flip chip packaging
Author_Institution :
MCNC Adv. Interconnection & Packaging Technol., Research Triangle Park, NC, USA
Abstract :
A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided
Keywords :
flip-chip devices; integrated circuit packaging; reflow soldering; MCNC; Unitive Electronics; deposition categories; electrochemical deposition; flip chip packaging; liquid phase deposition; solder bumping methods; solid phase deposition; vapor phase deposition; Costs; Electronics packaging; Flip chip; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Manufacturing industries; Resists; Solids; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606176
