DocumentCode :
2069111
Title :
Effect of polysilicon gate doping concentration variation on MOSFET characteristics
Author :
Dutta, Ritaban ; Kundu, Sandipan
Author_Institution :
Dept. of Comput. Sci. Eng., West Bengal Univ. of Technol., Kolkata, India
fYear :
2012
fDate :
17-19 Dec. 2012
Firstpage :
1
Lastpage :
4
Abstract :
Polysilicon gates have replaced the metal gates in CMOS technology. If the doping is not high enough in polysilicon then the flatband voltage should be corrected. Polysilicon gates are also depleted with the application of gate voltage. The dependence of MOSFET current (Ids) on polysilicon gate concentration is studied using the results simulated by Sentaurus TCAD tool in case of N channel MOSFETs. With the decrease in polysilicon gate doping concentration (Nd), the drain current is more degraded. A theory is developed, in order to explain the simulation results that take into consideration the correction in flatband voltage and the voltage drop due to polysilicon depletion. From the analysis of simulated and theoretical curves, an inversion region is suspected to occur at the polysilicon gate for low doping concentration at high gate voltage.
Keywords :
CMOS integrated circuits; MOSFET; electric potential; elemental semiconductors; semiconductor doping; silicon; technology CAD (electronics); CMOS technology; N channel MOSFET characteristics; Sentaurus TCAD tool simulation; Si; drain current; flatband voltage drop; polysilicon depletion; polysilicon gate doping concentration effect; Sentaurus; flatband voltage; polysilicon gate depletion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computers and Devices for Communication (CODEC), 2012 5th International Conference on
Conference_Location :
Kolkata
Print_ISBN :
978-1-4673-2619-3
Type :
conf
DOI :
10.1109/CODEC.2012.6509245
Filename :
6509245
Link To Document :
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