DocumentCode
2069111
Title
Effect of polysilicon gate doping concentration variation on MOSFET characteristics
Author
Dutta, Ritaban ; Kundu, Sandipan
Author_Institution
Dept. of Comput. Sci. Eng., West Bengal Univ. of Technol., Kolkata, India
fYear
2012
fDate
17-19 Dec. 2012
Firstpage
1
Lastpage
4
Abstract
Polysilicon gates have replaced the metal gates in CMOS technology. If the doping is not high enough in polysilicon then the flatband voltage should be corrected. Polysilicon gates are also depleted with the application of gate voltage. The dependence of MOSFET current (Ids) on polysilicon gate concentration is studied using the results simulated by Sentaurus TCAD tool in case of N channel MOSFETs. With the decrease in polysilicon gate doping concentration (Nd), the drain current is more degraded. A theory is developed, in order to explain the simulation results that take into consideration the correction in flatband voltage and the voltage drop due to polysilicon depletion. From the analysis of simulated and theoretical curves, an inversion region is suspected to occur at the polysilicon gate for low doping concentration at high gate voltage.
Keywords
CMOS integrated circuits; MOSFET; electric potential; elemental semiconductors; semiconductor doping; silicon; technology CAD (electronics); CMOS technology; N channel MOSFET characteristics; Sentaurus TCAD tool simulation; Si; drain current; flatband voltage drop; polysilicon depletion; polysilicon gate doping concentration effect; Sentaurus; flatband voltage; polysilicon gate depletion;
fLanguage
English
Publisher
ieee
Conference_Titel
Computers and Devices for Communication (CODEC), 2012 5th International Conference on
Conference_Location
Kolkata
Print_ISBN
978-1-4673-2619-3
Type
conf
DOI
10.1109/CODEC.2012.6509245
Filename
6509245
Link To Document