• DocumentCode
    2069111
  • Title

    Effect of polysilicon gate doping concentration variation on MOSFET characteristics

  • Author

    Dutta, Ritaban ; Kundu, Sandipan

  • Author_Institution
    Dept. of Comput. Sci. Eng., West Bengal Univ. of Technol., Kolkata, India
  • fYear
    2012
  • fDate
    17-19 Dec. 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Polysilicon gates have replaced the metal gates in CMOS technology. If the doping is not high enough in polysilicon then the flatband voltage should be corrected. Polysilicon gates are also depleted with the application of gate voltage. The dependence of MOSFET current (Ids) on polysilicon gate concentration is studied using the results simulated by Sentaurus TCAD tool in case of N channel MOSFETs. With the decrease in polysilicon gate doping concentration (Nd), the drain current is more degraded. A theory is developed, in order to explain the simulation results that take into consideration the correction in flatband voltage and the voltage drop due to polysilicon depletion. From the analysis of simulated and theoretical curves, an inversion region is suspected to occur at the polysilicon gate for low doping concentration at high gate voltage.
  • Keywords
    CMOS integrated circuits; MOSFET; electric potential; elemental semiconductors; semiconductor doping; silicon; technology CAD (electronics); CMOS technology; N channel MOSFET characteristics; Sentaurus TCAD tool simulation; Si; drain current; flatband voltage drop; polysilicon depletion; polysilicon gate doping concentration effect; Sentaurus; flatband voltage; polysilicon gate depletion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computers and Devices for Communication (CODEC), 2012 5th International Conference on
  • Conference_Location
    Kolkata
  • Print_ISBN
    978-1-4673-2619-3
  • Type

    conf

  • DOI
    10.1109/CODEC.2012.6509245
  • Filename
    6509245