The effects on SI and EMI for differential coupled microstrip lines over LPC-EBG power/ground planes

A power/ground planes design for efficiently eliminating the ground bounce noise (GBN) in high-speed digital circuits is proposed by using low-period coplanar electromagnetic band-gap (LPC-EBG) structure. However, it is unavoidable the signals will cross the LPC-EBG power plane. In this paper, the effects of signal integrity (SI) and electromagnetic interference (EMI) for differential coupled microstrip lines over the LPC-EBG power/ground planes will be investigated. The resonant frequency of LPC-EBG power plane will be picked up and appear in the radiation. The bandgap frequencies of LPC-EBG power plane will loss in weakly coupling case of differential lines at the received end. Further, the more coupling factor of differential lines is the less noise of SI and EMI is. The simulated results based on full-wave simulator will provide a good reference for the design of differential coupled microstrip lines over LPC-EBG power/ground planes.