• DocumentCode
    2069747
  • Title

    The annealing effect of chemical vapor deposited graphene

  • Author

    Shen, Y.L. ; Zhou, Peng ; Wang, L.H. ; Sun, Q.Q. ; Tao, Q.Q. ; Wang, P.F. ; Ding, S.J. ; Zhang, David Wei

  • Author_Institution
    ASIC & Syst. State Key Lab., Fudan Univ., Shanghai, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Chemical vapor deposited (CVD) graphene is one of the most widely-used methods to get large-area graphene. However, both CVD fabrication process and necessary transfer process will introduce a lot of defects. Therefore, reducing the defects in CVD graphene is a critical problem. In this work, we report the annealing effect to reduce the defects in graphene fabricated by CVD and transferred to Si/SiO2 substrate. We annealed the CVD samples at five different temperatures in N2 for 30 s. The Raman spectroscopy shows the defects can be reduced in the range of 200°C to 600°C. Atomic force microscopy (AFM) also indicates a much smoother surface can be reached below 600°C. When the annealing temperature above 800°C, the average carbon-carbon distance increases with the temperature. This will lead to a larger corrugation which is one kind of defects. Thermal expansion generated by high temperature will also damage the graphene lattice structure and therefore produces more disorders.
  • Keywords
    Raman spectra; annealing; atomic force microscopy; chemical vapour deposition; crystal defects; crystal structure; graphene; thermal expansion; AFM; C; CVD fabrication process; CVD graphene; Raman spectroscopy; Si-SiO2; annealing effect; atomic force microscopy; carbon-carbon distance; chemical vapor deposited graphene; defects; graphene lattice structure; smooth surface; temperature 200 degC to 600 degC; thermal expansion; time 30 s; transfer process; Annealing; Films; Graphene; Lattices; Silicon; Substrates; Surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6812069
  • Filename
    6812069