Mixed signal ASIC design issues and methodologies

A broad overview is presented of the major design issues related to creating mixed analog/digital application-specific integrated circuits (ASICs). This subject is discussed from the perspective of a potential customer or designer by outlining the design decisions, limitations, tradeoffs and requirements he or she will face during the course of a mixed signal ASIC project. The major technical issues are identified as process selection, module selection and creation, simulation, and mixed signal placement and routing. The major aspects of these issues are discussed, and common methodologies, as well as new research for meeting design requirements, are illustrated. Examples illustrating the design technique using the ChipCrafter/MAX product are presented