• DocumentCode
    2070688
  • Title

    Biostability issues of flash gold surfaces

  • Author

    Beshchasna, N. ; Adolphi, B. ; Granovsky, S. ; Uhlemann, J. ; Wolter, K.-J.

  • Author_Institution
    Electron. Packaging Lab., Dresden
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    1071
  • Lastpage
    1079
  • Abstract
    Being chemically inert and non-toxic and having excellent electrical properties gold is known as one of the most suitable materials for fabrication of long-term implantable electronic devices. In spite of this fact, stability of structures with flash gold finish layers (electroless Ni @ immersion Au or electroless Ni @ electroless Pd @ immersion Au), widely used in electronics packaging, is questionable. Such layer configurations are often characterized as not sufficiently stable by applications in humid or corrosive environments and are poorly investigated under the influence of physiological factors as living tissues, microorganisms and body fluids. In this work biostability of FR4 @ 50 mum Cu @ 4 mum Ni @ 0.1 mum Au in simulated blood plasma was studied. The samples were stressed dynamically in a special circulation system, keeping the values of temperature, pressure and flow velocity similar to the natural parameters of a human body. The alterations in topography and structure integrity, chemical composition and wetting properties of the samples surfaces have been investigated by optical microscopy, atomic force microscopy (AFM), laser profilometry, contact angle measurements, X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD). Cracks formation and delamination of a gold layer, significant mass losses and precipitation of the foreign substances have been observed.
  • Keywords
    X-ray diffraction; X-ray photoelectron spectra; bioelectric phenomena; contact angle; electronics packaging; gold; prosthetics; X-ray diffraction; X-ray photoelectron spectroscopy; atomic force microscopy; biostability; chemically inert; contact angle measurements; cracks formation; delamination; electrical properties; electronics packaging; flash gold surfaces; laser profilometry; long-term implantable electronic devices; optical microscopy; Atom optics; Atomic force microscopy; Chemical lasers; Gold; Optical microscopy; Photoelectron microscopy; Plasma simulation; Plasma temperature; Surface topography; X-ray lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074145
  • Filename
    5074145