DocumentCode
2070735
Title
Modelling of the power pin diode under surge current conditions
Author
Nowak, J. ; Bakowski, M. ; Lisik, Z. ; Wozny, J. ; Owczarek, M.
Author_Institution
Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol., Kista, Sweden
fYear
2004
fDate
28-28 Feb. 2004
Firstpage
529
Lastpage
532
Abstract
Fast recovery silicon (Si) power diodes, having radiation induced recombination centres, operating under forward bias at large current densities and high temperatures, have been studied in a detailed way, both experimentally and with the help of device simulation Medici package. The comparison of the dynamic I-V characteristics with the results of numerical simulations is possible only when all the specific features of the measurement set-up are taken into account in the simulations. Such evaluation of the electro-thermal numerical model of the diode under experiment combined with the electro-thermal model of the experimental set-up as the boundary condition for Medici simulation is being presented. The main issue is the definition of the thermal boundary conditions.
Keywords
current density; electron-hole recombination; elemental semiconductors; numerical analysis; p-i-n diodes; power semiconductor diodes; semiconductor device models; silicon; surges; Medici package; Si; current density; dynamic I-V characteristics; electro-thermal numerical model; fast recovery silicon power diodes; forward bias; modelling; numerical simulations; power pin diode; radiation induced recombination centres; surge current conditions; thermal boundary conditions; Boundary conditions; Current density; Diodes; Medical simulation; Numerical models; Numerical simulation; Packaging; Silicon; Surges; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004. Proceedings of the International Conference
Conference_Location
Lviv-Slavsko, Ukraine
Print_ISBN
966-553-380-0
Type
conf
Filename
1366056
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