• DocumentCode
    2070766
  • Title

    Effect of arc behavior on material transfer: a review

  • Author

    Chen, Zhuan-Ke ; Sawa, Koichiro

  • Author_Institution
    Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
  • fYear
    1996
  • fDate
    16-20 Sept. 1996
  • Firstpage
    238
  • Lastpage
    251
  • Abstract
    One of the serious problems of arcing in relays and switches is leading to material transfer, thus resulting in the loss of contact material and the early end of lifetime. Although this phenomenon has been studied for many years, there are still many unsolved problems. This paper is a review of material transfer due to arcing based on published work by the authors and by the other investigators. Included are a discussion of transfer mechanism, called PSD model (particle sputtering and deposition model); a survey of contact materials, circuit parameters, electrode temperatures, and surrounding gases which have been determined to affect arc behavior and material transfer; the effect of contact surface temperature distribution, arc spot dimension, arc root stability, and arc duration on wearout or loss of contact material from two contacts; and an idea of balance transfer ("zero" loss) operation. It is expected that this paper could supply some basic considerations for controlling material transfer in practical applications.
  • Keywords
    arcs (electric); circuit-breaking arcs; electrical contacts; electrodes; relays; switches; temperature distribution; wear; PSD model; arc behavior; arc duration; arc root stability; arc spot dimension; arcing; balance transfer; circuit parameters; contact material; contact surface temperature distribution; electrode temperatures; material transfer; relays; switches; wearout; Arc discharges; Circuits; Contacts; Electrodes; Gases; Relays; Reliability engineering; Sputtering; Switches; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1996. Proceedings of the Forty-Second IEEE Holm Conference on ??. Joint with the 18th International Conference on Electrical Contacts
  • Conference_Location
    Chicago, IL, USA
  • Print_ISBN
    0-7803-3578-3
  • Type

    conf

  • DOI
    10.1109/HOLM.1996.557203
  • Filename
    557203