• DocumentCode
    2070918
  • Title

    Rough surface effects in parallel plate waveguide at gigahertz frequencies

  • Author

    Ding, Ruihua ; Tsang, Leung ; Braunisch, Henning ; Wu, Weijiu

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Washington, Seattle, WA
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    1132
  • Lastpage
    1138
  • Abstract
    We consider a parallel plate waveguide model excited by a line source to address the rough surface effect in an environment more directly applicable to package substrates and PCBs. The problem is solved by the finite element method (FEM). The FEM is applied to the region between the metal plates of the waveguide. The excitation line source is outside the numerical modeling region. Modal basis functions are used in the input plane and the numerical modeling area is discretized by the finite element method. Each modal basis function acts as the excitation source for the FEM model and yields linear algebraic equations that are solved by direct sparse symmetric matrix inversion. Convergence of the model is demonstrated by varying the realization number. The numerical model accuracy is validated by comparing the numerical simulation result and analytical result of smooth parallel plate waveguide structure. Numerical results are illustrated to show the power loss due to the rough surface as a function of the surface parameters RMS height and correlation length. Comparisons are made between the absorption enhancement factor obtained from the numerical FEM model and SPM result of the previous plane wave model and the waveguide model.
  • Keywords
    finite element analysis; matrix inversion; modal analysis; parallel plate waveguides; printed circuits; rough surfaces; FEM model; PCB; direct sparse symmetric matrix inversion; finite element method; linear algebraic equation; modal basis function; package substrates; parallel plate waveguide; rough surface effect; Convergence; Equations; Finite element methods; Frequency; Numerical models; Packaging; Rough surfaces; Surface roughness; Surface waves; Symmetric matrices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074154
  • Filename
    5074154