• DocumentCode
    2070942
  • Title

    Innovative material applications in the electronic industry

  • Author

    Bach, Friedrich-Wilhelm ; Duda, Thomas

  • Author_Institution
    Inst. of Mater. Technol., Dortmund Univ., Germany
  • Volume
    4
  • fYear
    1998
  • fDate
    31 Aug-4 Sep 1998
  • Firstpage
    2275
  • Abstract
    New material concepts and innovative material applications gain more and more interest under the aspect of continuously increasing functional and structural demands. New materials as well as composites are able to match these requirements. One promising concept is the separation between structural and functional surfaces respectively parts for optimised properties. This concept offers a variety of advantages, e.g. for miniaturisation, and therefore comes along with economical as well as ecological advantages. Innovative surfacing techniques, like thermal spraying techniques in combination with new developed consumables and diagnostic techniques can be utilized for modifying the surface with respect to the application. Furthermore new application fields are developed by these techniques. Examples for successful applications are the spraying of SOFC cells as well as the manufacturing of high-temperature superconductors
  • Keywords
    electronics industry; materials; spray coating techniques; SOFC cells; consumables; diagnostic techniques; ecological advantage; economic advantages; electronics industry; functional demands; high-temperature superconductor manufacture; innovative material applications; material concepts; miniaturisation; structural demands; surfacing techniques; thermal spraying; Acceleration; Coatings; Electronics industry; Geometry; Plasma materials processing; Plasma temperature; Powders; Reliability engineering; Thermal engineering; Thermal spraying;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, 1998. IECON '98. Proceedings of the 24th Annual Conference of the IEEE
  • Conference_Location
    Aachen
  • Print_ISBN
    0-7803-4503-7
  • Type

    conf

  • DOI
    10.1109/IECON.1998.724075
  • Filename
    724075