Title :
Future aspects of MEMS in Germany [microelectromechanical systems]
Author :
Töpfer, Manfred ; Werner, Matthias ; Kaulfersch, Eberhard ; Reichl, Herbert
Author_Institution :
Tech. Univ. Berlin, Germany
fDate :
31 Aug-4 Sep 1998
Abstract :
The integration of electronic, acoustic, mechanical, thermal, optical and magnetic functions within one product is one of the great challenges for future microelectromechanical systems (MEMS) today. The development of advanced materials plays a key role for the design and development of new MEMS. Application fields and examples as well as future visions of microsystem technology are highlighted in this article. Additionally, some of the borders and requirements of today´s MEMS design are also pointed out
Keywords :
integrated circuits; micromechanical devices; Germany; advanced materials development; application fields; future prospects; microelectromechanical systems; microsystem technology; Costs; Crystalline materials; Manufacturing; Mechanical systems; Microelectronics; Micromechanical devices; Optical materials; Silicon; Surface resistance; Temperature;
Conference_Titel :
Industrial Electronics Society, 1998. IECON '98. Proceedings of the 24th Annual Conference of the IEEE
Conference_Location :
Aachen
Print_ISBN :
0-7803-4503-7
DOI :
10.1109/IECON.1998.724086
