DocumentCode
2071164
Title
Future aspects of MEMS in Germany [microelectromechanical systems]
Author
Töpfer, Manfred ; Werner, Matthias ; Kaulfersch, Eberhard ; Reichl, Herbert
Author_Institution
Tech. Univ. Berlin, Germany
Volume
4
fYear
1998
fDate
31 Aug-4 Sep 1998
Firstpage
2331
Abstract
The integration of electronic, acoustic, mechanical, thermal, optical and magnetic functions within one product is one of the great challenges for future microelectromechanical systems (MEMS) today. The development of advanced materials plays a key role for the design and development of new MEMS. Application fields and examples as well as future visions of microsystem technology are highlighted in this article. Additionally, some of the borders and requirements of today´s MEMS design are also pointed out
Keywords
integrated circuits; micromechanical devices; Germany; advanced materials development; application fields; future prospects; microelectromechanical systems; microsystem technology; Costs; Crystalline materials; Manufacturing; Mechanical systems; Microelectronics; Micromechanical devices; Optical materials; Silicon; Surface resistance; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics Society, 1998. IECON '98. Proceedings of the 24th Annual Conference of the IEEE
Conference_Location
Aachen
Print_ISBN
0-7803-4503-7
Type
conf
DOI
10.1109/IECON.1998.724086
Filename
724086
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