DocumentCode
2071187
Title
A Study on crosstalk analysis in aggregative transmission lines with turning vias
Author
Bandyopadhyay, Tapobrata ; Shan, Lei ; Kwark, Young ; Ritter, Mark ; Gu, Xiaoxiong ; Baks, Christian ; John, Richard ; Tummala, Rao
Author_Institution
Georgia Inst. of Technol., Atlanta, GA
fYear
2009
fDate
26-29 May 2009
Firstpage
1185
Lastpage
1192
Abstract
This paper presents measurement, modeling and simulation studies of high-speed signal propagation in multi-layered PCB with turning vias (immediate layer changing) in a mixed-referencing environment. The effects of turning vias, plane referencing, decoupling capacitor placement and, panel dimensions on high-speed signal propagation in an organic board are studied.
Keywords
capacitors; crosstalk; printed circuits; telecommunication transmission lines; aggregative transmission line; crosstalk analysis study; decoupling capacitor placement; high-speed signal propagation; mixed-referencing environment; multilayered PCB turning vias effect; panel dimension; Capacitors; Circuit noise; Crosstalk; Power system modeling; Power transmission lines; Signal analysis; Testing; Transmission lines; Turning; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074162
Filename
5074162
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