The MCM/MCP thermal characteristic and its circuit representations

Expanded from the thermal characteristics of single chip packages, a matrix form thermal characteristic for MCM and MCPs is introduced in this paper. The validity of this characteristic is investigated through a few most commonly used MCM, MCP assembly configurations and mounting boards. A detail discussion is made on the relationship between the thermal characteristic, θ matrix and its thermal circuit representation. In addition, two techniques are introduced to extract the equivalent thermal network from a given θ matrix or directly from numerical modeling. The extracted thermal network is also tested by numerical examples and has proved to be accurate enough for higher system level applications