A new flexible method for re-running regional OPC to meet the ECO requirements

Author

Zhang, Yufu ; Zhang, Hongbo ; Shi, Zheng

Author_Institution

Inst. of VLSI Design, Zhejiang Univ., Hangzhou

fYear

2006

fDate

7-10 Nov. 2006

Firstpage

168

Lastpage

171

Abstract

For emerging deep-subwavelength lithography technologies (65 nm and following) the computation cost and complexities of the conventional resolution enhancement technologies (RET) such as optical proximity correction (OPC) are themselves becoming bottlenecks in the IC manufacturing flow. This has motivated the recent calls for faster and more flexible solutions. In this paper, we present a new algorithm and a general flow which can be used for implementing regional OPC to meet the increasing needs of engineering change order. Using this new method, approximately 80% run-time is saved and the same accuracy maintained as compared to the conventional OPC methods. Several new concepts such as segmentation matching and smooth transition are brought forward to overcome the ripple effects and stitch the Regional OPC result back into the whole layout.

Keywords

design for manufacture; integrated circuit economics; integrated circuit layout; integrated circuit testing; integrated circuit yield; proximity effect (lithography); IC manufacturing; deep-subwavelength lithography technologies; design-to-manufacture; engineering change order; optical proximity correction; resolution enhancement technologies; ripple effects; segmentation matching; smooth transition; Computational efficiency; Computer aided manufacturing; Costs; Flexible manufacturing systems; Lithography; Optical computing; Optical design; Photonic integrated circuits; Runtime; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics and Photonics, 2006. MEP 2006. Multiconference on

Conference_Location

Guanajuato

Print_ISBN

1-4244-0627-7

Electronic_ISBN

1-4244-0628-5

Type

conf

DOI

10.1109/MEP.2006.335655

Filename

4135739