Methodology for minimizing far-end noise coupling between interconnects in high-speed ceramic modules

In this paper, we present a methodology for minimizing far-end (FE) noise coupling between interconnects in high-speed ceramic modules. The high FE noise coupling between signal interconnects in ceramic modules has been a serious bottleneck for high-performance systems. A methodology employing power/ground mesh planes with minimized orthogonal lines and a via-connected coplanar-type shield (VCS) structure has been developed to minimize FE noise coupling between signal lines in ceramic modules. Optimized interconnect structure based on this methodology has demonstrated that the saturated FE crosstalk of a typical interconnect structure in ceramic modules could be reduced significantly by 88.7%.