• DocumentCode
    2071380
  • Title

    Jitter suppressed on-chip clock distribution using package plane cavity resonance

  • Author

    Lee, Woojin ; Ryu, Chunghyun ; Park, Jongbae ; Kim, Joungho

  • Author_Institution
    Dept. of EECS, Korea Adv. Inst. of Sci. & Technol., Daejeon
  • fYear
    2008
  • fDate
    19-23 May 2008
  • Firstpage
    427
  • Lastpage
    430
  • Abstract
    This paper presents a chip-package hybrid clock distribution network using package or PCB plane cavity resonance. This structure enhances Q factor through low loss plane cavity and lowers phase noise. A voltage-controlled oscillator generates clock signal and off-chip driver circuit with the structure of harmonic rejection mixer excites the plane resonance. The plane cavity resonator consists of the embedded planes in package and an inductive load. The resonant frequency can be controlled by the inductance and the various destination points like local buffers can be connected to the plane. We simulate the proposed chip-package co-design with the transmission line matrix modelling and the simulation results show that the source jitter is suppressed by the resonance effect.
  • Keywords
    Q-factor; circuit resonance; clocks; electronics packaging; inductance; integrated circuit interconnections; jitter; transmission line matrix methods; PCB plane cavity resonance; Q factor; chip-package hybrid clock distribution network; harmonic rejection mixer; jitter suppression; local buffers; off-chip driver circuit; on-chip clock distribution; package plane cavity resonance; transmission line matrix modelling; voltage-controlled oscillator; Clocks; Driver circuits; Jitter; Packaging; Phase noise; Q factor; Resonance; Signal generators; Transmission line matrix methods; Voltage-controlled oscillators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-981-08-0629-3
  • Electronic_ISBN
    978-981-08-0629-3
  • Type

    conf

  • DOI
    10.1109/APEMC.2008.4559903
  • Filename
    4559903