• DocumentCode
    2071445
  • Title

    State of the art in wireless sensing with surface acoustic waves

  • Author

    Bulst, W.-E. ; Fischerauer, G. ; Reindl, L.

  • Author_Institution
    Corp. Res. & Technol., Siemens AG, Munich, Germany
  • Volume
    4
  • fYear
    1998
  • fDate
    31 Aug-4 Sep 1998
  • Firstpage
    2391
  • Abstract
    Surface acoustic wave (SAW) devices can be turned into novel identification and sensor elements (transponders) that do not need any power supply and may be interrogated wirelessly. Such a transponder picks up an electromagnetic request signal and stores it until all echoes caused by multipath propagation have died away. Then, a characteristic response signal is beamed back to the interrogator unit. In radio-link sensors, a physical or chemical quantity influences the propagation properties of the SAW and consequently changes the response pattern of the device. This contribution surveys the operating principle of such sensors and their state-of-the-art performance. The discussion is supported by illustrative examples such as temperature sensors and sensors for mechatronic applications
  • Keywords
    mechatronics; radio applications; radio links; surface acoustic wave sensors; temperature sensors; chemical quantity; electromagnetic request signal; identification elements; interrogator unit; mechatronic application sensors; multipath propagation; operating principle; physical quantity; propagation properties; radio-link sensors; sensor elements; state of the art; state-of-the-art performance; surface acoustic wave devices; surface acoustic waves; temperature sensors; wireless sensing; Acoustic sensors; Acoustic waves; Chemical sensors; Electromagnetic propagation; Sensor phenomena and characterization; Surface acoustic wave devices; Surface acoustic waves; Temperature sensors; Transponders; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, 1998. IECON '98. Proceedings of the 24th Annual Conference of the IEEE
  • Conference_Location
    Aachen
  • Print_ISBN
    0-7803-4503-7
  • Type

    conf

  • DOI
    10.1109/IECON.1998.724099
  • Filename
    724099