Title :
Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Author :
Iker, F. ; Funaya, T. ; Teixeira, R.C. ; Ruythooren, W.
Author_Institution :
IMEC, Leuven
Abstract :
We report on the use of the diamond bit cutting technique in the fabrication of polymer embedded Cu interconnects. This fabrication technique is an attractive alternative to standard patterning techniques used to fabricate such interconnect structures e.g. lithographic, dry etching or laser patterning.
Keywords :
copper; cutting; diamond; integrated circuit interconnections; polymers; 3D interconnections technology; Cu; diamond bit cutting; polymer embedded copper interconnection fabrication; polymer patterning; Dielectrics; Dry etching; Laser beam cutting; Lithography; Optical device fabrication; Polymers; Rough surfaces; Stacking; Surface roughness; Surface topography;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074176
