DocumentCode
2071610
Title
Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Author
Iker, F. ; Funaya, T. ; Teixeira, R.C. ; Ruythooren, W.
Author_Institution
IMEC, Leuven
fYear
2009
fDate
26-29 May 2009
Firstpage
1284
Lastpage
1288
Abstract
We report on the use of the diamond bit cutting technique in the fabrication of polymer embedded Cu interconnects. This fabrication technique is an attractive alternative to standard patterning techniques used to fabricate such interconnect structures e.g. lithographic, dry etching or laser patterning.
Keywords
copper; cutting; diamond; integrated circuit interconnections; polymers; 3D interconnections technology; Cu; diamond bit cutting; polymer embedded copper interconnection fabrication; polymer patterning; Dielectrics; Dry etching; Laser beam cutting; Lithography; Optical device fabrication; Polymers; Rough surfaces; Stacking; Surface roughness; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074176
Filename
5074176
Link To Document