• DocumentCode
    2071798
  • Title

    Substrate-geometry aware 2-port modeling for surface-mount passive components

  • Author

    Yamanaga, Koh ; Sato, Takashi ; Masu, Kazuya

  • Author_Institution
    Integrated Res. Inst., Tokyo Inst. of Technol., Tokyo
  • fYear
    2008
  • fDate
    19-23 May 2008
  • Firstpage
    498
  • Lastpage
    501
  • Abstract
    Electrical modeling methodology for surface-mount passive components is proposed. In order to accurately capture parasitic inductance, the proposed 2-port model accounts for surrounding ground layer configurations of the print circuit board (PCB) on which the component is mounted. Our model retains conventional modeling paradigm in which component suppliers provide their customers with simulation models characterized independently of the customerspsila PCB. We also present necessary corrections that compensate missing magnetic coupling between the models. Impedance of a power distribution network is experimentally analyzed being non-separated modeling as the reference. The proposed model achieved very good match with the reference result reducing 10-30% error of the conventional model to within 1%.
  • Keywords
    inductance; printed circuits; surface mount technology; two-port networks; electrical modeling methodology; ground layer configurations; magnetic coupling; parasitic inductance; power distribution network; print circuit board; substrate-geometry aware 2-port modeling; surface-mount passive components; Capacitors; Circuit simulation; Electromagnetic compatibility; Electromagnetic modeling; Inductance; Large scale integration; Magnetic separation; Power systems; Printed circuits; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-981-08-0629-3
  • Electronic_ISBN
    978-981-08-0629-3
  • Type

    conf

  • DOI
    10.1109/APEMC.2008.4559921
  • Filename
    4559921