Eutectic solder flip chip technology-bumping and assembly process development for CSP/BGA

Author

Aoki, Hideo ; Takubo, Chiaki ; Nakazawa, Takahito ; Honma, Soichi ; Doi, Kazuhide ; Miyata, Masahiro ; Ezawa, Hirokazu ; Hiruta, Yoichi

Author_Institution

Semicond. Manuf. Eng. Center, Toshiba Corp., Yokohama, Japan

fYear

1997

fDate

18-21 May 1997

Firstpage

325

Lastpage

331

Abstract

Eutectic solder flip chip fabrication technology, through bumping to assembly process, has been developed. In bumping process, electroplating method and thick photo resist process could form eutectic solder bumps whose uniformity of height are less than 10% within wafer. Eutectic solder flip chip assembly process, which includes bonding, cleaning and underfilling, has been also developed. Bonding process of eutectic solder indicates good self-alignment. The excellent rosin cleaning was achieved by the ultrasonic cleaning process with Techno Care. In underfilling process, the underfill resin which can be applied to small stand-off have been chosen. Reliability tests for CSP and flip chip interconnection were carried out and confirmed the good reliability of fabrication process using eutectic solder flip chip technology

Keywords

eutectic alloys; flip-chip devices; integrated circuit packaging; microassembling; soldering; BGA; CSP; assembly; bonding; bumping; electroplating; eutectic solder flip chip technology; fabrication; photoresist; process development; reliability; rosin cleaning; self-alignment; ultrasonic cleaning; underfilling; Assembly; Ceramics; Chip scale packaging; Cleaning; Electronics packaging; Fabrication; Flip chip; Resists; Sputter etching; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606188

Filename

606188