DocumentCode
2072117
Title
Injection molding techniques for epoxy molding compounds
Author
Glauch, Dieter ; Rajadhyaksha, Mangesh ; Buchmann, Hans-Fred ; Martell, Scott R. ; Schwab, Heinz ; Pilato, Lucian0
fYear
1997
fDate
22-25 Sep 1997
Firstpage
7
Lastpage
13
Abstract
An injection molding technique for epoxy molding compounds is described that has significant advantages in performance, efficiency and reliability. This technique has utility in many applications such as automotive ignition systems, sensors, other electronic components, heavy electrical insulators, bushings and various transformers. Topics presented include mold design, processing conditions, performance properties with comparison to thermoplastics and suitable applications
Keywords
encapsulation; manufacture; materials preparation; polymers; automotive ignition systems; bushings; efficiency; electronic components; encapsulation; epoxy molding compounds; heavy electrical insulators; injection molding techniques; mold design; performance; performance properties; processing conditions; reliability; sensors; thermoplastics; transformers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1997, and Electrical Manufacturing & Coil Winding Conference. Proceedings
Conference_Location
Rosemont, IL
ISSN
0362-2479
Print_ISBN
0-7803-3959-2
Type
conf
DOI
10.1109/EEIC.1997.650955
Filename
650955
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