Miniaturization of electromagnetic bandgap structures for noise suppression

Advancement in semiconductor technologies including CMOS and SiGe is enabling the commercialisation of devices that have increased switching speed, reduced power supply and increased circuit complexity. Proliferation of high-speed systems in both digital and mixed-signal applications is also driving the need for advanced noise suppression techniques. This paper describes a novel approach of using miniaturized electromagnetic bandgap structures. By leveraging on low shrinkage composite ceramics technology to increase the dielectric loading of the EBG structures, we have achieved significant improvement in the bandwidth and start frequency of more than 30% and 90%, respectively, when compared with conventional approaches.