DocumentCode :
2072238
Title :
The electrical properties of chemical vapor deposited silicon oxide films for applications as interlayer dielectrics in ULSI
Author :
Loiko, Konstantin V. ; Vassiliev, Vladislav Y. ; Chua, Chee Tee ; Lim, David H Y
Author_Institution :
Dept. of R&D, Chartered Semicond. Manuf. Ltd., Singapore
Volume :
1
fYear :
1997
fDate :
19-22, Oct 1997
Firstpage :
150
Abstract :
The electrical properties of plasma-enhanced undoped silicon dioxide and subatmospheric pressure chemical vapor deposited borophosphosilicate glass films used in sub-half-micron ULSI were investigated and compared for 200 mm p-type silicon wafers. The capacitance-voltage (C-V), surface photo voltage (SPV), and current-voltage (I-V) measurement methods were applied for characterization of the film properties. The revealed variation of the charge and current values across the wafer for as-deposited and densified films and its causes are discussed
Keywords :
ULSI; borosilicate glasses; characteristics measurement; dielectric thin films; integrated circuit measurement; phosphosilicate glasses; plasma CVD; silicon compounds; 200 mm; B2O3-P2O5-SiO2-SiO2-Si; BPSG-SiO2-Si; ULSI; capacitance-voltage measurement; current values; current-voltage measurement; densified films; interlayer dielectrics; plasma-enhanced chemical vapor deposition; surface photo voltage measurement; Capacitance-voltage characteristics; Chemicals; Glass; Plasma chemistry; Plasma measurements; Plasma properties; Semiconductor films; Silicon compounds; Ultra large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 1997. IEEE 1997 Annual Report., Conference on
Conference_Location :
Minneapolis, MN
Print_ISBN :
0-7803-3851-0
Type :
conf
DOI :
10.1109/CEIDP.1997.634581
Filename :
634581
Link To Document :
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