Design of power supply noise and radiation free power—Ground plane for modern system in package

The design of power distribution network to deliver noise free power to high performance systems of increasing package density, high clock speed, high power demand at low voltages, and large current change with fast slew-rate is a challenging task. We design this novel structure according to a kind of plant leaf nutrient delivering system. There is good agreement between the numerical prediction method and the measurement results. The measured S₂₁ is below -10 dB and SSN (simultaneous switching noise) cannot deliver into chip power system. The solders increase the DC (direct current) resistance 2.7% for the novel power-ground plane and 18.68% for traditional structure. The Swiss-Chess structure effect (high resistance metal areas because of distributed via and solders and leading to the voltages or currents to the circuit - elements lower than design demand) is reduced. The simulated gain shows there is no antenna effect for our designed power-ground plane.