3D image sensor SiP with TSV silicon interposer

Author

Limansyah, I. ; Wolf, M.J. ; Klumpp, A. ; Zoschke, K. ; Wieland, R. ; Klein, M. ; Oppermann, H. ; Nebrich, L. ; Heinig, A. ; Pechlaner, A. ; Reichl, H. ; Weber, W.

Author_Institution

Infineon Technol., Munich

fYear

2009

fDate

26-29 May 2009

Firstpage

1430

Lastpage

1436

Abstract

3D system integration is a fast growing field that encompasses different types of technologies. The technology chosen for a specific application will be selected according to the required electrical performance of the systems, the footprint, cost and time to market. Other important factors are the boundary conditions given for the specific components e.g. die size, integration compatibility, component availability (wafer vs. bare die) and testability. The paper discusses a specific 3D image sensor system for automotive applications. The system is based on wafer level technology using silicon interposer with Through Silicon Vias (TSV´s), a flip chip assembled sensor element and a microcontroller. The specific system concept, the technical solution and results are discussed.

Keywords

automotive electronics; flip-chip devices; image sensors; microcontrollers; system-in-package; wafer level packaging; 3D image sensor; 3D system integration; 3D-system-in-package; TSV silicon interposer; automotive applications; electrical performance; flip chip assembled sensor element; microcontroller; through silicon vias; wafer level technology; Automotive applications; Availability; Boundary conditions; Costs; Flip chip; Image sensors; Silicon; Testing; Through-silicon vias; Time to market;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4244-4475-5

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2009.5074199

Filename

5074199