Title :
A case for wireless 3D NoCs for CMPs
Author :
Matsutani, Hiroshi ; Bogdan, Paul ; Marculescu, Radu ; Take, Y. ; Sasaki, D. ; Hao Zhang ; Koibuchi, Michihiro ; Kuroda, Tadahiro ; Amano, Hideharu
Author_Institution :
Keio Univ., Yokohama, Japan
Abstract :
Inductive-coupling is yet another 3D integration technique that can be used to stack more than three known-good-dies in a SiP without wire connections. We present a topology-agnostic 3D CMP architecture using inductive-coupling that offers great flexibility in customizing the number of processor chips, SRAM chips, and DRAM chips in a SiP after chips have been fabricated. In this paper, first, we propose a routing protocol that exchanges the network information between all chips in a given SiP to establish efficient deadlock-free routing paths. Second, we propose its optimization technique that analyzes the application traffic patterns and selects different spanning tree roots so as to minimize the average hop counts and improve the application performance.
Keywords :
DRAM chips; SRAM chips; circuit optimisation; multiprocessing systems; network routing; network-on-chip; system-in-package; trees (mathematics); 3D integration technique; DRAM chip; SRAM chip; SiP; application traffic pattern; deadlock-free routing path; inductive-coupling; optimization technique; processor chips; routing protocol; spanning tree; topology-agnostic 3D CMP architecture; wireless 3D NoC; Ad hoc networks; Optimization; Routing; Routing protocols; Three-dimensional displays; Topology; Wireless communication;
Conference_Titel :
Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4673-3029-9
DOI :
10.1109/ASPDAC.2013.6509553
