Improved eigenmode expansion method for investigating of ground bounce in power/ground plane with holes in PCBs

An improved eigenmode expansion method (EEM) is proposed for analyzing power/ground plane pairs in high-speed printed circuit boards (PCB). We notice that the EEM is only applicable for regular structures in a PCB, such as rectangular and circular geometries, and it costs much computational time. Therefore, asymptotic waveform evaluation (AWE) technique and inverted composition method are combined with the EEM for capturing frequency-dependent transfer and self impedances of the power/ground plane with single or even many holes. The simulation results show that good agreements are achieved between our results and those obtained by finite-element method (FEM).